Calibrated Wideband Measurement of Packaged Devices Using Transient Analysis Techniques

FİDANBOYLU K., RIAD S.

3rd Intl. SAMPE Electronics Conf., LOS ANGELES, CALIFORNIA, United States Of America, 20 - 22 June 1989, pp.516-527

  • Publication Type: Conference Paper / Full Text
  • City: LOS ANGELES, CALIFORNIA
  • Country: United States Of America
  • Page Numbers: pp.516-527
  • Bursa Uludag University Affiliated: No