Calibrated wideband measurement of packaged devices


Fidanboylu K., Riad S. M.

3rd International SAMPE Electronics Conference: Electronic Materials and Processes, Los-Angeles, Chile, 20 - 22 June 1989, vol.3, pp.516-527 identifier

  • Publication Type: Conference Paper / Full Text
  • Volume: 3
  • City: Los-Angeles
  • Country: Chile
  • Page Numbers: pp.516-527

Abstract

A new technique is proposed for the measurement of the S-paramaters of a microwave device where standard network analyzer calibration is difficult to implement. Examples of such cases include the wideband characterization of electronic packages and on-wafer circuits and components. The technique enables the use of coaxial standards in calibrating the network analyzer at a convenient coaxial calibration plane other than measurement plane. Measurement planes can be at the transition probe tips for an on-wafer circuit, or at the mounted device inside an electronic package. The technique is demonstrated by an application to the determination of the scattering parameters of a planar transmission line through the use of coplanar transition probes. Each transition probe used in the measurements is characterized by using time domain measurements and computer simulation. The characterization yields an equivalent network model for each probe which eventually is used in computing their S-parameters.