WIDE-BAND AND MICROWAVE MATERIAL CHARACTERIZATION

RIAD S., DAVIS W., ELSHABINIRIAD A., SAED M., AMEY D., CURILLA J., ...More

4TH ELECTRONIC MATERIALS AND PROCESSING CONGRESS : MATERIALS DEVELOPMENTS IN MICROELECTRONIC PACKAGING : PERFORMANCE AND RELIABILITY, Montreal, Canada, 01 January 1991, pp.123-126, (Full Text) identifier

  • Publication Type: Conference Paper / Full Text
  • Volume:
  • City: Montreal
  • Country: Canada
  • Page Numbers: pp.123-126
  • Bursa Uludag University Affiliated: No