RIAD, S. Et Al. 1991. WIDE-BAND AND MICROWAVE MATERIAL CHARACTERIZATION. 4TH ELECTRONIC MATERIALS AND PROCESSING CONGRESS : MATERIALS DEVELOPMENTS IN MICROELECTRONIC PACKAGING : PERFORMANCE AND RELIABILITY , (Montreal, Canada), 123-126.

RIAD, S., DAVIS, W., ELSHABINIRIAD, A., SAED, M., AMEY, D., CURILLA, J., ... LYLES, J.(1991). WIDE-BAND AND MICROWAVE MATERIAL CHARACTERIZATION . 4TH ELECTRONIC MATERIALS AND PROCESSING CONGRESS : MATERIALS DEVELOPMENTS IN MICROELECTRONIC PACKAGING : PERFORMANCE AND RELIABILITY (pp.123-126). Montreal, Canada

RIAD, S Et Al. "WIDE-BAND AND MICROWAVE MATERIAL CHARACTERIZATION," 4TH ELECTRONIC MATERIALS AND PROCESSING CONGRESS : MATERIALS DEVELOPMENTS IN MICROELECTRONIC PACKAGING : PERFORMANCE AND RELIABILITY, Montreal, Canada, 1991

RIAD, S Et Al. "WIDE-BAND AND MICROWAVE MATERIAL CHARACTERIZATION." 4TH ELECTRONIC MATERIALS AND PROCESSING CONGRESS : MATERIALS DEVELOPMENTS IN MICROELECTRONIC PACKAGING : PERFORMANCE AND RELIABILITY , Montreal, Canada, pp.123-126, 1991

RIAD, S. Et Al. (1991) . "WIDE-BAND AND MICROWAVE MATERIAL CHARACTERIZATION." 4TH ELECTRONIC MATERIALS AND PROCESSING CONGRESS : MATERIALS DEVELOPMENTS IN MICROELECTRONIC PACKAGING : PERFORMANCE AND RELIABILITY , Montreal, Canada, pp.123-126.

@conferencepaper{conferencepaper, author={S RIAD Et Al. }, title={WIDE-BAND AND MICROWAVE MATERIAL CHARACTERIZATION}, congress name={4TH ELECTRONIC MATERIALS AND PROCESSING CONGRESS : MATERIALS DEVELOPMENTS IN MICROELECTRONIC PACKAGING : PERFORMANCE AND RELIABILITY}, city={Montreal}, country={Canada}, year={1991}, pages={123-126} }