JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS, cilt.10, sa.2, ss.298-301, 2008 (SCI-Expanded)
Electroplating technique is especially interesting due to its low cost and high quality of deposits being extensively used in industry. In this work, Cu film is electrodeposited on n-type Si (100) substrate using constant current mode. The electrical properties of Cu/n-Si were investigated at several temperatures. The current-voltage analysis based on the thermionic emission theory has revealed an abnormal decrease of apparent barrier height and increase of ideality factor at low temperatures.