This research work presents a comparative thermal performance assessment of the laminar flow cooling blocks produced for automotive headlight assembly using a high power Light Emitting Diode (LED) chip. A three-dimensional numerical model with conjugate heat transfer in solid and fluid domains was used. Laminar flow was considered in the present analysis. The validation of the numerical model was realized by using the measured data from the test rig. It was observed that substantial temperature variations were occurred around the LED chip owing to volumetric heat generation. The cooling board with lower height performs better thermal performance but higher pressure drop for the same mass flow rates. The cooling board with the finned cover plate performs better thermal performance but results in an increased pressure drop for the same mass flow rates. Increasing the power of the LED results in higher temperature values for the same mass flow rates. The junction temperature is highly dependent on the mass flow rates and LED power. It can be controlled by means of the mass flow rate of the coolant fluid. New Nusselt number correlations are proposed for laminar flow mini-channel liquid cooling block applications.