MAGNETORESISTANCE IN ELECTRODEPOSITED NI-FE-CU/CU MULTILAYERS
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, vol.148, no.1-2, pp.335-336, 1995 (SCI-Expanded, Scopus)
- Publication Type: Article / Article
- Volume: 148 Issue: 1-2
- Publication Date: 1995
- Doi Number: 10.1016/0304-8853(95)89007-6
- Journal Name: JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS
- Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
- Page Numbers: pp.335-336
- Bursa Uludag University Affiliated: No
Abstract
Multilayers of Ni-Fe-Cu/Cu have been electrodeposited from a single electrolyte onto polycrystalline (100) textured and (100) single crystal copper substrates. Bilayer thicknesses as low as 30 Angstrom have been achieved, as confirmed by X-ray diffraction. Room temperature magnetoresistance measurements show the presence of giant magnetoresistance (GMR) and an anisotropic magnetoresistance (AMR) component in the films.