S. Tummala Et Al. , "EVALUATION OF BIOMECHANICAL PERFORMANCES OF ELECTROSPUN FIBER ANCHORED SILICONE DISC AS AN INTERVERTEBRAL DISC IMPLANT," ASME International Mechanical Engineering Congress and Exposition , Tama, Japan, 2017
Tummala, S. Et Al. 2017. EVALUATION OF BIOMECHANICAL PERFORMANCES OF ELECTROSPUN FIBER ANCHORED SILICONE DISC AS AN INTERVERTEBRAL DISC IMPLANT. ASME International Mechanical Engineering Congress and Exposition , (Tama, Japan).
Tummala, S., DOĞAN, O., KARPAT, F., Riahinezhad, S., & Khandaker, M., (2017). EVALUATION OF BIOMECHANICAL PERFORMANCES OF ELECTROSPUN FIBER ANCHORED SILICONE DISC AS AN INTERVERTEBRAL DISC IMPLANT . ASME International Mechanical Engineering Congress and Exposition, Tama, Japan
Tummala, Subhakar Et Al. "EVALUATION OF BIOMECHANICAL PERFORMANCES OF ELECTROSPUN FIBER ANCHORED SILICONE DISC AS AN INTERVERTEBRAL DISC IMPLANT," ASME International Mechanical Engineering Congress and Exposition, Tama, Japan, 2017
Tummala, Subhakar Et Al. "EVALUATION OF BIOMECHANICAL PERFORMANCES OF ELECTROSPUN FIBER ANCHORED SILICONE DISC AS AN INTERVERTEBRAL DISC IMPLANT." ASME International Mechanical Engineering Congress and Exposition , Tama, Japan, 2017
Tummala, S. Et Al. (2017) . "EVALUATION OF BIOMECHANICAL PERFORMANCES OF ELECTROSPUN FIBER ANCHORED SILICONE DISC AS AN INTERVERTEBRAL DISC IMPLANT." ASME International Mechanical Engineering Congress and Exposition , Tama, Japan.
@conferencepaper{conferencepaper, author={Subhakar Tummala Et Al. }, title={EVALUATION OF BIOMECHANICAL PERFORMANCES OF ELECTROSPUN FIBER ANCHORED SILICONE DISC AS AN INTERVERTEBRAL DISC IMPLANT}, congress name={ASME International Mechanical Engineering Congress and Exposition}, city={Tama}, country={Japan}, year={2017}}