Alper, M. Et Al. 2004. Preparation and characterisation of electrodeposited Ni-Cu/Cu multilayers. JOURNAL OF APPLIED ELECTROCHEMISTRY , no.8 , 841-848.

Alper, M., Baykul, M., Peter, L., Toth, J., & Bakonyi, I., (2004). Preparation and characterisation of electrodeposited Ni-Cu/Cu multilayers. JOURNAL OF APPLIED ELECTROCHEMISTRY , no.8, 841-848.

Alper, MÜRSEL Et Al. "Preparation and characterisation of electrodeposited Ni-Cu/Cu multilayers," JOURNAL OF APPLIED ELECTROCHEMISTRY , no.8, 841-848, 2004

Alper, MÜRSEL Et Al. "Preparation and characterisation of electrodeposited Ni-Cu/Cu multilayers." JOURNAL OF APPLIED ELECTROCHEMISTRY , no.8, pp.841-848, 2004

Alper, M. Et Al. (2004) . "Preparation and characterisation of electrodeposited Ni-Cu/Cu multilayers." JOURNAL OF APPLIED ELECTROCHEMISTRY , no.8, pp.841-848.

@article{article, author={MÜRSEL ALPER Et Al. }, title={Preparation and characterisation of electrodeposited Ni-Cu/Cu multilayers}, journal={JOURNAL OF APPLIED ELECTROCHEMISTRY}, year=2004, pages={841-848} }