HAYES, M. Et Al. 1991. ADVANCES IN MICROWAVE SUBSTRATE MATERIALS. 4TH ELECTRONIC MATERIALS AND PROCESSING CONGRESS : MATERIALS DEVELOPMENTS IN MICROELECTRONIC PACKAGING : PERFORMANCE AND RELIABILITY , (Montreal, Canada), 37-40.

HAYES, M., FIDANBOYLU, K., ELSHABINIRIAD, A., ELY, K., & BAHL, I., (1991). ADVANCES IN MICROWAVE SUBSTRATE MATERIALS . 4TH ELECTRONIC MATERIALS AND PROCESSING CONGRESS : MATERIALS DEVELOPMENTS IN MICROELECTRONIC PACKAGING : PERFORMANCE AND RELIABILITY (pp.37-40). Montreal, Canada

HAYES, MB Et Al. "ADVANCES IN MICROWAVE SUBSTRATE MATERIALS," 4TH ELECTRONIC MATERIALS AND PROCESSING CONGRESS : MATERIALS DEVELOPMENTS IN MICROELECTRONIC PACKAGING : PERFORMANCE AND RELIABILITY, Montreal, Canada, 1991

HAYES, MB Et Al. "ADVANCES IN MICROWAVE SUBSTRATE MATERIALS." 4TH ELECTRONIC MATERIALS AND PROCESSING CONGRESS : MATERIALS DEVELOPMENTS IN MICROELECTRONIC PACKAGING : PERFORMANCE AND RELIABILITY , Montreal, Canada, pp.37-40, 1991

HAYES, M. Et Al. (1991) . "ADVANCES IN MICROWAVE SUBSTRATE MATERIALS." 4TH ELECTRONIC MATERIALS AND PROCESSING CONGRESS : MATERIALS DEVELOPMENTS IN MICROELECTRONIC PACKAGING : PERFORMANCE AND RELIABILITY , Montreal, Canada, pp.37-40.

@conferencepaper{conferencepaper, author={MB HAYES Et Al. }, title={ADVANCES IN MICROWAVE SUBSTRATE MATERIALS}, congress name={4TH ELECTRONIC MATERIALS AND PROCESSING CONGRESS : MATERIALS DEVELOPMENTS IN MICROELECTRONIC PACKAGING : PERFORMANCE AND RELIABILITY}, city={Montreal}, country={Canada}, year={1991}, pages={37-40} }