Tekgul, A. Et Al. 2018. Electrochemical, Structural and Magnetic Analysis of Electrodeposited CoCu/Cu Multilayers: Influence of Cu Layer Deposition Potential. JOURNAL OF ELECTRONIC MATERIALS , vol.47, no.3 , 1896-1903.

Tekgul, A., KÖÇKAR, H., KURU, H., ALPER, M., & ÜNLÜ, C. G., (2018). Electrochemical, Structural and Magnetic Analysis of Electrodeposited CoCu/Cu Multilayers: Influence of Cu Layer Deposition Potential. JOURNAL OF ELECTRONIC MATERIALS , vol.47, no.3, 1896-1903.

Tekgul, Atakan Et Al. "Electrochemical, Structural and Magnetic Analysis of Electrodeposited CoCu/Cu Multilayers: Influence of Cu Layer Deposition Potential," JOURNAL OF ELECTRONIC MATERIALS , vol.47, no.3, 1896-1903, 2018

Tekgul, Atakan Et Al. "Electrochemical, Structural and Magnetic Analysis of Electrodeposited CoCu/Cu Multilayers: Influence of Cu Layer Deposition Potential." JOURNAL OF ELECTRONIC MATERIALS , vol.47, no.3, pp.1896-1903, 2018

Tekgul, A. Et Al. (2018) . "Electrochemical, Structural and Magnetic Analysis of Electrodeposited CoCu/Cu Multilayers: Influence of Cu Layer Deposition Potential." JOURNAL OF ELECTRONIC MATERIALS , vol.47, no.3, pp.1896-1903.

@article{article, author={Atakan Tekgul Et Al. }, title={Electrochemical, Structural and Magnetic Analysis of Electrodeposited CoCu/Cu Multilayers: Influence of Cu Layer Deposition Potential}, journal={JOURNAL OF ELECTRONIC MATERIALS}, year=2018, pages={1896-1903} }